LAD5100 is an automatic single spindle 8"" wafer dicing saw designed for various dicing applications such as silicon, silicon carbide, ceramic, glass, QFN and DFN, delivering long-term reliability and outstanding durability.
Y axis positioning accuracy
0.002mm/260mm
轉速
6000-60000rpm
Continuous and stable
Highly stable system, excellent hardware quality and continuously upgraded software system, satisfying 7*24 production requirement of customer.
Highly accurate
Cumulative accuracy 0.002mm/260mm
Highly efficient
Top control system from Germany and self-developed motion control algorithms, achieving dicing efficiency comparable to foreign equivalent products
Highly adaptable
NCS (Non-contact Setup) and BBD (Blade Breakage Detection) are standard features
Easy to use
User-friendly operation interface, upgrade of software as requested by customer, easy for customer to import
+86-0510-81816658
sales@wxautowell.com
No.3 Xinhua Road,
